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CAE Project

CAE Project

About V-Glace

[Glass Mold Simulation CAE Software]

“V-Glace ” The “World’s First” CAE software

The “World’s First” CAE software that can simulate the process of glass mold forming by incorporating glass properties, developed in collaboration with RIKEN. 3D simulation of the glass mold forming process using V-Glace enables process optimization and results analysis.

Glass Mold

The software can perform stress analysis, heat transfer analysis, structural relaxation analysis, and viscoelastic analysis of molds and glass during the pressing process at high temperatures.
In particular, it can be used as a guideline for process optimization because it can output virtual temperatures that serve as an indicator of changes in the glass state during the cooling process. As a result, the intuition and experience of skilled workers and the behavior of samples in the mold, which until now have been a black box, can be quantified, contributing to improved quality and productivity through the accumulation of know-how.

Video of Simulation Results

Shorten Development Period and Reduce Costs

By performing a simulation before mold design, it is possible to predict correction points such as molds, molding conditions, and preforms. As a result, the number of mold modifications and prototypes can be reduced, contributing to shorter development times and lower costs.

Lens Molding Process Diagram

Simulation Samples

We present four sample simulations.It is possible to analyze the heat transfer, shape change, stress time changes, of the glass material in the mold with animation.This allows us to observe  the differences in glass material behavior caused by differences in preform geometry and molding patterns.
*Sample shows 1/4 of the whole

Examples of Simulations Requested by Customers

We received a request from a customer and performed a product simulation.
We used L-BAL42 (OHARA) glass, provided a sleeve on the outside, and analyzed the final shape, heat transfer, and internal stress distribution.
By analyzing the final product shape and internal stress distribution, it is possible to confirm the need for modification of the mold shape and preform and annealing.
*Dimensions and molding conditions are not disclosed.

Contract Analysis of Sample Physical Properties

It measures and acquires the physical property values of samples used in simulations, contributing to more accurate simulations. Creep, friction coefficient, and structural relaxation parameters, which are essential for simulation, will be performed at RIKEN. General-purpose measurements are performed at industrial technology centers and public testing laboratories.
Item Mesuring Method Mesuring Device
Young’s Modulus
/Poisson’s Ratio
Ultrasonic Pulse-Echo Method Modulus Measuring Device
Thermal Conductivity Pulse Heating Method Xe Flash Analyzer
Specific heat, Coefficient of thermal expansion Differential Thermal Analysis, Thermogravimetry Thermal Analyzer
Density Specific Gravity Electronic Balance
Grip Parameters Compression Experiment Material Testing Machine
Coefficient of Friction Ring  Compression Experiment  Experiment Using a Molding Machine
Structural Relaxation Parameter Density Mesurement(Specific Gravity Measurement) Experiment Using Structural Relaxation Measurement Equipment and Specific Gravity Measurement
List of Measurement Items

Latest Information

  • In preparation

Software Environment

Operating System
Windows10
CPU * Multi-Socket Support Planned
Intel CPU (Core i series, Xeon series,6 cores or more recommended)
Memory
16GB or more is recommended
HDD
1GB (installation area, 500MB or more data area)
USB Port *A USB hub can be used
3 pieces (for solver, for meshers, for post)
Screen
FHD (1920 x 1080) or more recommended (*) Multi-socket compatible
If you have any enquiries, please click here
Download optical elements meeting materials